Ionized physical vapor deposition (IPVD): A review of technology and applications

HELMERSSON, U., LATTEMANN, M., BOHLMARK, J., EHIASARIAN, A. P. and GUDMUNDSSON, J. T. (2006). Ionized physical vapor deposition (IPVD): A review of technology and applications. Thin Solid Films, 513 (1-2), 1-24.

Full text not available from this repository.
Link to published version:: https://doi.org/10.1016/j.tsf.2006.03.033

Abstract

In plasma-based deposition processing, the importance of low-energy ion bombardment during thin film growth can hardly be exaggerated. Ion bombardment is an important physical tool available to materials scientists in the design of new materials and new structures. Glow discharges and in particular, the magnetron sputtering discharge have the advantage that the ions of the discharge are abundantly available to the deposition process. However. the ion chemistry is usually dominated by the ions of the inert sputtering gas while ions of the sputtered material are me. Over the last few years, Various ionized sputtering techniques have appeared that can achieve a high degree of ionization of the sputtered atoms, often tip to 50% but in some cases as much as approximately 90%. This opens a complete new perspective in the engineering and design of new thin film materials. The development and application of magnetron sputtering systems for ionized physical vapor deposition (IPVD) is reviewed. The application of a secondary discharge, inductively coupled plasma magnetron sputtering (ICP-MS) and microwave amplified magnetron sputtering. is discussed as well as the high power impulse magnetron sputtering (HIPIMS), the self-sustained sputtering (SSS) magnetron, and the hollow cathode magnetron (HCM) sputtering discharges. Furthermore, filtered arc-deposition is discussed due to its importance as all IPVD technique. Examples of the importance of the IPVD-techniques for growth of thin films with improved adhesion, improved microstructures, improved coverage of complex shaped substrates, and increased reactivity with higher deposition rate in reactive processes are reviewed. (c) 2006 Elsevier B.V. All rights reserved.

Item Type: Article
Research Institute, Centre or Group - Does NOT include content added after October 2018: Materials and Engineering Research Institute > Advanced Coatings and Composites Research Centre > Nanotechnology Centre for PVD Research
Identification Number: https://doi.org/10.1016/j.tsf.2006.03.033
Page Range: 1-24
Depositing User: Ann Betterton
Date Deposited: 18 Feb 2010 17:14
Last Modified: 18 Mar 2021 09:45
URI: https://shura.shu.ac.uk/id/eprint/1196

Actions (login required)

View Item View Item

Downloads

Downloads per month over past year

View more statistics