Effect of Cu doping on the microstructure and mechanical properties of AlTiVN-Cu nanocomposite coatings

MEI, Haijuan, GENG, Dongsen, WANG, Rui, CHENG, Lixia, DING, Ji Cheng, LUO, Quanshun, ZHANG, Teng Fei and WANG, Qimin (2020). Effect of Cu doping on the microstructure and mechanical properties of AlTiVN-Cu nanocomposite coatings. Surface and Coatings Technology, p. 126490.

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Link to published version:: https://doi.org/10.1016/j.surfcoat.2020.126490


Cu phase has been incorporated into hard coatings to form nanocomposite structure, which not only enhanced the hardness but also the toughness due to excellent ductility of copper. In this study, a single Al67Ti33-V-Cu spliced target was used to prepare the AlTiVN-Cu nanocomposite coatings, and the effect of Cu doping on microstructure and mechanical properties of AlTiVN-Cu coatings has been investigated. The results showed that the deposition rate linearly increased from 3.8 to 13.4 nm/min when Cu content increased from 2.6 to 46.7 at.%. AlTiVN-Cu coatings exhibited a Ti-Al-V-N solid-solution phase with strong (111) preferred orientation at low Cu contents below 8.3 at.%. When Cu content increased above 22.6 at.%, Cu atoms grew up into metallic crystallites and strongly suppressed crystal growth of nitride coatings due to repeated nucleation. With increasing Cu content, the microstructure transferred from compact columnar to dense featureless, and then to coarse columnar structure. AlTiVN-Cu(2.6 at.%) coating exhibited a super hardness of 41.1 GPa and an excellent toughness with a high H3/E*2 ratio of 0.24.

Item Type: Article
Uncontrolled Keywords: Applied Physics; 0204 Condensed Matter Physics; 0306 Physical Chemistry (incl. Structural); 0912 Materials Engineering
Identification Number: https://doi.org/10.1016/j.surfcoat.2020.126490
Page Range: p. 126490
SWORD Depositor: Symplectic Elements
Depositing User: Symplectic Elements
Date Deposited: 21 Oct 2020 11:20
Last Modified: 14 Oct 2021 01:18
URI: https://shura.shu.ac.uk/id/eprint/27480

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