Plasma analysis of Inductively Coupled Impulse Sputtering of Cu, Ti and Ni

LOCH, Daniel, ARANDA GONZALVO, Yolanda and EHIASARIAN, Arutiun (2017). Plasma analysis of Inductively Coupled Impulse Sputtering of Cu, Ti and Ni. Plasma Sources Science and Technology, 26 (6).

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Inductively coupled impulse sputtering (ICIS) is a new development in the field of highly ionised pulsed PVD processes. For ICIS the plasma is generated by an internal inductive coil, replacing the need for a magnetron. To understand the plasma properties, measurements of the current and voltage waveforms at the cathode were conducted. The IEDFs were measured by energy resolved MS and plasma chemistry was analysed by OES and then compared to a model. The target was operated in pulsed DC mode and the coil was energised by pulsed RF power, with a duty cycle of 7.5 %. At a constant pressure (14 Pa) the set peak RF power was varied from 1000-4000 W. The DC voltage to the target was kept constant at 1900 V. OES measurements have shown a monotonic increase in intensity with increasing power. Excitation and ionisation processes were single step for ICIS of Ti and Ni and multi-step for Cu. The latter exhibited an unexpectedly steep rise in ionisation efficiency with power. The IEDFs measured by MS show the material- and time- dependant plasma potential in the range of 10-30 eV, ideal for increased surface mobility without inducing lattice defects. A lower intensity peak, of high energetic ions, is visible at 170 eV during the pulse.

Item Type: Article
Uncontrolled Keywords: ICIS,
Research Institute, Centre or Group - Does NOT include content added after October 2018: Materials and Engineering Research Institute > Advanced Coatings and Composites Research Centre > Nanotechnology Centre for PVD Research
Departments - Does NOT include content added after October 2018: Faculty of Science, Technology and Arts > Department of Engineering and Mathematics
Identification Number:
Depositing User: Daniel Loch
Date Deposited: 16 Jun 2017 10:35
Last Modified: 18 Mar 2021 15:34

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