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MCDONALD, C, RANNOW, RK, PAI, D, BULLAS, Alice and BALLESTER, A (2020). IEEE SA industry connections 3D body processing working group and IEEE P3141 standard for 3D body processing - Part 2. IEEE Consumer Electronics Magazine, 9 (6), 97-99.
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Bullas-IEEESAIndustryConnections(AM).pdf - Accepted Version All rights reserved. Download (258kB) | Preview |
Official URL: https://ieeexplore.ieee.org/document/9099602
Link to published version:: https://doi.org/10.1109/MCE.2020.2997556
Abstract
The IEEE 3D Body Processing Industry Connections Working Group (3DBP IC) brings together a diverse group of stakeholders including computer scientists, research and development personnel, 3D body scanner vendors, retailers and associated consultants, individuals from adjacent markets, and thought leaders around 3D body processing technologies (3D capture, processing, storage, sharing, and virtualization).
| Item Type: | Article |
|---|---|
| Additional Information: | © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
| Uncontrolled Keywords: | Three-dimensional displays; Standards; Industries; Metadata; Integrated circuits; Consumer electronics; Footwear |
| Identification Number: | https://doi.org/10.1109/MCE.2020.2997556 |
| Page Range: | 97-99 |
| SWORD Depositor: | Symplectic Elements |
| Depositing User: | Symplectic Elements |
| Date Deposited: | 11 May 2022 15:22 |
| Last Modified: | 11 May 2022 15:22 |
| URI: | https://shura.shu.ac.uk/id/eprint/30104 |
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