IEEE SA industry connections 3D body processing working group and IEEE P3141 standard for 3D body processing - Part 2

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MCDONALD, C, RANNOW, RK, PAI, D, BULLAS, Alice and BALLESTER, A (2020). IEEE SA industry connections 3D body processing working group and IEEE P3141 standard for 3D body processing - Part 2. IEEE Consumer Electronics Magazine, 9 (6), 97-99. [Article]

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30104:603982

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Abstract

The IEEE 3D Body Processing Industry Connections Working Group (3DBP IC) brings together a diverse group of stakeholders including computer scientists, research and development personnel, 3D body scanner vendors, retailers and associated consultants, individuals from adjacent markets, and thought leaders around 3D body processing technologies (3D capture, processing, storage, sharing, and virtualization).

More Information

Official URL:

https://ieeexplore.ieee.org/document/9099602

Additional Information:

© 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

Uncontrolled Keywords:

Three-dimensional displays; Standards; Industries; Metadata; Integrated circuits; Consumer electronics; Footwear

Page Range:

97-99

Identifiers

Identification Number:

10.1109/MCE.2020.2997556

ORCID for Alice Bullas: