Transmission electron microscopy and x-ray diffraction investigation of the microstructure of nanoscale multilayer TiAlN/VN grown by unbalanced magnetron deposition

LUO, Q., LEWIS, D. B., HOVSEPIAN, P. E. and MUNZ, W. D. (2004). Transmission electron microscopy and x-ray diffraction investigation of the microstructure of nanoscale multilayer TiAlN/VN grown by unbalanced magnetron deposition. Journal of Materials Research, 19 (4), 1093-1104.

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Link to published version:: https://doi.org/10.1557/JMR.2004.0143

Abstract

Cubic NaCl-B1 structured multilayer TiAlN/VN with a bi-layer thickness of approximately 3 nm and atomic ratios of (Ti+Al)/V = 0.98 to 1.15 and Ti/V = 0.55 to 0.61 were deposited by unbalanced magnetron sputtering at substrate bias voltages between -75 and -150 V. In this paper, detailed transmission electron microscopy and x-ray diffraction revealed pronounced microstructure changes depending on the bias. At the bias -75 V, TiAlN/VN followed a layer growth model led by a strong (110) texture to form a T-type structure in the Thornton structure model of thin films, which resulted in a rough growth front, dense columnar structure with inter-column voids, and low compressive stress of -3.8 GPa. At higher biases, the coatings showed a typical Type-II structure following the strain energy growth model, characterized by the columnar structure, void-free column boundaries, smooth surface, a predominant (111) texture, and high residual stresses between -8 and -11.5 GPa.

Item Type: Article
Research Institute, Centre or Group - Does NOT include content added after October 2018: Materials and Engineering Research Institute > Materials Analysis and Research Services
Materials and Engineering Research Institute > Advanced Coatings and Composites Research Centre > Nanotechnology Centre for PVD Research
Identification Number: https://doi.org/10.1557/JMR.2004.0143
Page Range: 1093-1104
Depositing User: Ann Betterton
Date Deposited: 17 Feb 2010 16:25
Last Modified: 18 Mar 2021 13:47
URI: https://shura.shu.ac.uk/id/eprint/1134

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