Electroplating of semiconductor Materials for Applications in Large Area Electronics: A Review

OJO, Ayotunde Adigun and DHARMADASA, I (2018). Electroplating of semiconductor Materials for Applications in Large Area Electronics: A Review. Coatings, 8 (8), p. 262.

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Official URL: http://www.mdpi.com/2079-6412/8/8
Link to published version:: https://doi.org/10.3390/coatings8080262
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    Abstract

    The attributes of electroplating as a low-cost, simple, scalable, and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, ultraviolet-visible spectroscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive X-ray spectroscopy, and photoelectrochemical cell studies. Based on the results of structural, morphological, compositional, optical, and electronic properties evaluated, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable for producing excellent devices. In this paper we will describe the progress of electroplating techniques mainly for the deposition of semiconductor thin film materials and their treatment processes, and fabrication of solar cells.

    Item Type: Article
    Research Institute, Centre or Group - Does NOT include content added after October 2018: Materials and Engineering Research Institute > Thin Films Research Centre > Electronic Materials and Sensors Research Group
    Identification Number: https://doi.org/10.3390/coatings8080262
    Page Range: p. 262
    Depositing User: Jill Hazard
    Date Deposited: 31 Jul 2018 13:44
    Last Modified: 16 Nov 2018 14:14
    URI: http://shura.shu.ac.uk/id/eprint/22159

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