Electro-mechanical analysis of thin-film substrate fuses using finite element methodology.

WILNIEWCZYC, Mariusz Pawel. (1999). Electro-mechanical analysis of thin-film substrate fuses using finite element methodology. Doctoral, Sheffield Hallam University (United Kingdom)..

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Abstract

In this thesis the electro-thermo-mechanical behaviour and withstand performance of constricted high-breaking capacity thin/thick film substrate fuse elements is examined. Three-dimensional time-varying non-linear CAD finite element modelling and simulation techniques were used to investigate the current-carrying capacity of a variety of single-layer and multilayer fuse geometries for DC and repetitive currents. The critical electro-thermally-induced stresses and strains were identified, and the techniques to achieve a reduction in the magnitude of these stresses & strains were investigated. Computational tools were developed to enable the prediction of the lifetime of thick-film substrate fuses subjected to cyclic-current loading conditions. The lifetime of a manufactured substrate fuse, subjected to a range of pulsed currents, was determined theoretically and correlated with the experimental findings. The onset of crack formation, conductive film de-bonding and lifting from the substrate and fatigue were studied computationally and experimentally. Photographic evidence of crack formation and propagation in the conductive film, film de-bonding from the substrate, metal dislocation and deformation in thin-thick film substrate fuse elements subjected to current pulses is presented.

Item Type: Thesis (Doctoral)
Additional Information: Thesis (Ph.D.)--Sheffield Hallam University (United Kingdom), 1999.
Research Institute, Centre or Group: Sheffield Hallam Doctoral Theses
Depositing User: EPrints Services
Date Deposited: 10 Apr 2018 17:22
Last Modified: 08 Jun 2018 10:36
URI: http://shura.shu.ac.uk/id/eprint/20547

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