NAYAL, G., EHIASARIAN, A. P., MACAK, K. M., NEW, R., MUNZ, W. D. and SMITH, I. J. (2001). A new low pressure plasma nitriding and PVD coating duplex treatment of HSS substrates. In: Progress in plasma processing of materials 2001. Begell House, 565-572.Full text not available from this repository.
In situ duplex plasma nitriding and PVD coating was performed using the combined steered arc unbalanced magnetron production scale unit (Hauzer HTC 1000/ABS). The processing procedure customary used was modified and further steps relating to the new plasma nitriding were added. In particular the total pressure during nitriding was reduced from 2-5 mbar, which is typical for pulse plasma nitriding process, to 5-10x10(-3) mbar. To enhance ionisation to a sufficiently high level the available four magnetrons were ignited at a low power level (0.5 W/cm(2)). Furthermore, electromagnetic coils were used to generate a closed magnetic field situation, thus, reducing the loss of electrons to the chamber walls. Using the duplex plasma nitriding (treatment time 30min.) and PVD treatment, 3 microns thick TiAlCrYN coatings were deposited onto flat HSS coupons. Scratch test results showed a substantial enhancement of the critical load (L-C > 80 N) compared to un-nitrided coated samples (Lc similar to 50 N). It is important to note that these high adhesion values have been obtained only when the thin build-up in carbon near the surface, which was generated during the plasma nitriding step, was etched away by metal ion etching with Cr+ directly prior to coating.
|Item Type:||Book Section|
|Additional Information:||Fauchais, P 6th European Conference on Thermal Plasma Processes MAY 30-JUN 03, 2000 STRASBOURG, FRANCE|
|Research Institute, Centre or Group:||Materials and Engineering Research Institute > Thin Films Research Centre > Nanotechnology Centre for PVD Research|
|Depositing User:||Ann Betterton|
|Date Deposited:||23 Feb 2010 16:56|
|Last Modified:||23 Feb 2010 16:56|
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