XeCl laser ablation of thin film ZnS

CRANTON, W. M., KEY, P. H., SANDS, D., THOMAS, C. B. and WAGNER, F. X. (1996). XeCl laser ablation of thin film ZnS. Applied Surface Science, 96-98, 501-504.

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Abstract

XeCl laser ablation of films of ZnS, with 200-600 MI thickness, on Si substrates has been studied at laser fluences lower than that required to damage the substrate material. The ZnS film ablation rate (depth of material removed per pulse) is observed to decrease with residual film thickness and increase with laser fluence. The fluence threshold for the onset of ablation is shown to depend inversely on the initial film thickness. This behaviour is explained in terms of a thermal removal mechanism in which the thermal properties of the substrate play a vital role in regulating the film ablation characteristics.

Item Type:	Article
Additional Information:	Cited By (since 1996):8 ID=204
Research Institute, Centre or Group - Does NOT include content added after October 2018:	Materials and Engineering Research Institute > Advanced Coatings and Composites Research Centre > Electronic Materials and Sensors Research Group
Identification Number:	https://doi.org/10.1016/0169-4332(95)00503-X
Page Range:	501-504
Depositing User:	Wayne Cranton
Date Deposited:	08 Feb 2016 11:00
Last Modified:	18 Mar 2021 23:00
URI:	https://shura.shu.ac.uk/id/eprint/8002

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